• DocumentCode
    682902
  • Title

    Investigation of methods for adhesion characterization of evaporated aluminum layers

  • Author

    Kumm, Julia ; Eberlein, Dirk ; Hartmann, Peter ; Wolke, Winfried ; Wolf, Alon ; Preu, Ralf

  • Author_Institution
    Fraunhofer Inst. for Solar Energy Syst. (ISE), Freiburg, Germany
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    1436
  • Lastpage
    1440
  • Abstract
    This paper analyzes methods for measuring the adhesion quality of aluminum (Al) rear metallization deposited by means of physical vapour deposition (PVD) on rear passivation layers of passivated emitter and rear silicon solar cells (PERC). Since the standard test procedures for adhesion testing of solar cells cannot be applied, a peel-test and a direct-pull method are introduced and used for measuring the adhesion of test samples; criteria for adhesion evaluation are developed and applied. The results of adhesion tests are compared and are in good general agreement. The applicability of the two methods is discussed and it is found that the peel-test shows more reliable results whereas the direct-pull method is easier in preparation. Moreover, the results of the test samples show sufficiently good adhesion quality for the PVD rear metallization of PERC solar cells.
  • Keywords
    aluminium; metallisation; passivation; solar cells; vapour deposition; Al; adhesion characterization; adhesion evaluation; direct-pull method; evaporated aluminum layers; passivated emitter; peel-test; physical vapour deposition; rear metallization; rear passivation layers; rear silicon solar cells; standard test procedures; Adhesives; Force; Metallization; Passivation; Photovoltaic cells; Silicon; Standards; Al-metallization; PVD; adhesion; aluminum; photovoltaic cells; silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/PVSC.2013.6744414
  • Filename
    6744414