• DocumentCode
    683193
  • Title

    Low cost Rear Ag paste using doping silver plated-coated Copper and Tin powder under N2 protection firing

  • Author

    Jing Yang ; Wenzhong Shen ; Lingjun Zhang ; Xusheng Wang ; Yanbin Xue ; Yanqi Li

  • Author_Institution
    Canadian Solar Inc., Suzhou, China
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    2292
  • Lastpage
    2294
  • Abstract
    Low cost Rear Ag paste is made by silver plated-coated Copper and Tin powder to replace part of pure Ag powder in the paste to reduce the cost of solar cell manufacture and also improve the adhesion of the solar cell busbar. The key issue to use Ag coated copper and tin is the oxidization of cooper and tin during the drying and firing process which will reduce the solderability and adhesion by using this system. We use N2 protection during drying and firing process to prevent the oxidization of cooper and tin. Therefore, the solderability and adhesion has been increased a lot to achieve the industry testing standard. Also Rs reduction is also a big achievement for this paste system.
  • Keywords
    adhesion; copper; doping; drying; firing (materials); silver; solar cells; tin; Ag; adhesion; copper oxidization; cost reduction; doping silver plated-coated copper-tin powder; drying process; firing process; industry testing standard; low-cost rear silver paste; nitrogen protection firing; solar cell busbar adhesion; solar cell manufacture; solderability; Adhesives; Copper; Firing; Photovoltaic cells; Powders; Silicon; Tin; Ag coated Copper; Rear Ag; Tin powder; photovoltaic cells;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/PVSC.2013.6744935
  • Filename
    6744935