DocumentCode
683193
Title
Low cost Rear Ag paste using doping silver plated-coated Copper and Tin powder under N2 protection firing
Author
Jing Yang ; Wenzhong Shen ; Lingjun Zhang ; Xusheng Wang ; Yanbin Xue ; Yanqi Li
Author_Institution
Canadian Solar Inc., Suzhou, China
fYear
2013
fDate
16-21 June 2013
Firstpage
2292
Lastpage
2294
Abstract
Low cost Rear Ag paste is made by silver plated-coated Copper and Tin powder to replace part of pure Ag powder in the paste to reduce the cost of solar cell manufacture and also improve the adhesion of the solar cell busbar. The key issue to use Ag coated copper and tin is the oxidization of cooper and tin during the drying and firing process which will reduce the solderability and adhesion by using this system. We use N2 protection during drying and firing process to prevent the oxidization of cooper and tin. Therefore, the solderability and adhesion has been increased a lot to achieve the industry testing standard. Also Rs reduction is also a big achievement for this paste system.
Keywords
adhesion; copper; doping; drying; firing (materials); silver; solar cells; tin; Ag; adhesion; copper oxidization; cost reduction; doping silver plated-coated copper-tin powder; drying process; firing process; industry testing standard; low-cost rear silver paste; nitrogen protection firing; solar cell busbar adhesion; solar cell manufacture; solderability; Adhesives; Copper; Firing; Photovoltaic cells; Powders; Silicon; Tin; Ag coated Copper; Rear Ag; Tin powder; photovoltaic cells;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/PVSC.2013.6744935
Filename
6744935
Link To Document