Title :
An experimental study on partial discharge characteristics in laminated CFRP plate
Author :
Abe, Kiyohiko ; Ohyama, Ryu-ichiro
Author_Institution :
Tokai Univ., Hiratsuka, Japan
Abstract :
CFRP (Carbon Fiber Reinforced Plastic) is functional material that is begin to be widely used in commercial aircraft, vehicle and etc. Investigation regarding the mechanical strength of CFRP is widely investigated. However, the electrical characteristics of this type of material are still not well known. Understanding the dielectric characteristics of CFRP is expected to lead to void detection technology of this material. In this work, the partial discharge (PD) characteristics of CFRP are experimentally investigated. In the experiment, two electrodes with 25 mm diameter were used as the discharge electrodes, and connected to a 50 Hz AC voltage source to generate PD inside the CFRP. Both of electrodes were insulated with thick glass epoxy frame to prevent surface discharge on CFRP sample. The sample was a CFRP sheet of 3K 2PLY form and glass epoxy with an artificial hole of diameter = 2 mm, each sample to which it was stuck between two glass epoxy sheets was used for the comparison. From the result, electrical characteristics different to glass epoxy were observed. This paper shows the influence of hole on the PD characteristics in laminated CFRP plate.
Keywords :
carbon fibre reinforced plastics; electrodes; epoxy insulation; laminations; mechanical strength; partial discharges; plates (structures); surface discharges; voids (solid); 3K 2PLY CFRP sheet; PD characteristics; artificial hole; carbon fiber reinforced plastic; commercial aircraft; dielectric characteristics; discharge electrodes; electrical characteristics; laminated CFRP plate; mechanical strength; partial discharge characteristics; size 2 mm; size 25 mm; surface discharge; thick glass epoxy frame; vehicle; void detection technology; Carbon; Cavity resonators; Discharges (electric); Electrodes; Glass; Partial discharges;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
DOI :
10.1109/CEIDP.2013.6748141