• DocumentCode
    684172
  • Title

    Feasibility of using a flat bottom electrode for PEA space charge measurement on mini-cables under high temperatures

  • Author

    Zheng, Haomian ; Dodd, S.J. ; Dissado, Leonard ; Fothergill, J. ; Allais, Arnaud ; Kebbabi, L.

  • Author_Institution
    Eng. Dept., Univ. of Leicester, Leicester, UK
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    1109
  • Lastpage
    1112
  • Abstract
    Pulsed Electro-Acoustic (PEA) apparatus has been developed to measure the space charge distribution inside XLPE based mini-cable insulation. The technique relies on the acoustic contact between the cylindrical cable surface and a flat aluminium plate to couple the acoustic waves to the sensor. This work addresses the feasibility of using this technique over a temperature range of 25 °C to 70 °C. The results demonstrate that increasing the temperature under constant clamping force causes the cable insulation to soften and distort increasing the contact area and signal from the PEA apparatus. However on subsequent cooling to 25 °C the mechanical distortion remains frozen-in with little change to the contact area. For reproducible space charge measurements it is necessary to first condition the cable sample by taking the cable and PEA through a temperature cycle before application of the applied voltage.
  • Keywords
    XLPE insulation; cable insulation; cooling; electrical contacts; pulsed electroacoustic methods; space charge; PEA space charge measurement; XLPE based mini-cable insulation; acoustic contact; acoustic waves; constant clamping force; cooling; cylindrical cable surface; flat bottom electrode; high temperatures; mechanical distortion; mini-cables; pulsed electro-acoustic apparatus; space charge distribution; temperature 25 degC to 70 degC; Cable insulation; Charge measurement; Clamps; Electrodes; Power cables; Space charge; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748261
  • Filename
    6748261