Dielectric properties of epoxy/POSS composites

Author

Heid, T. ; Frechette, Michel ; David, E.

Author_Institution

Inst. de Rech. d´Hydro-Quebec (IREQ), Varennes, QC, Canada

fYear

2013

fDate

20-23 Oct. 2013

Firstpage

751

Lastpage

755

Abstract

In this work, the dielectric responses of epoxy/POSS composites with different contents of liquid Triglycidylisobutyl-POSS (TGIB-POSS) varying from 1wt% to 10wt% were investigated using Broadband Dielectric Spectroscopy (BDS) at 20°C, before and after exposure to a post heat-treatment of the samples. Besides the known β-peak in the vicinity of 10⁵ Hz, an additional interfacial loss peak for the epoxy/POSS composites with more than 1wt% TGIB-POSS has been observed for low frequencies. Furthermore, loss tangent values of the composites were found to be reduced after incorporation of POSS, along with an increased volume resistivity, especially after thermal ageing. Differential Scanning Calorimetry (DSC) has shown a decrease in glass transition temperatures with increasing TGIB-POSS content.

Keywords

ageing; composite materials; dielectric properties; differential scanning calorimetry; epoxy insulation; heat treatment; ß-peak; BDS; DSC; TGIB-POSS; broadband dielectric spectroscopy; dielectric properties; dielectric response; differential scanning calorimetry; epoxy-POSS composites; glass transition temperatures; heat treatment; interfacial loss; liquid triglycidylisobutyl-POSS; temperature 20 degC; thermal ageing; volume resistivity; Conductivity; Dielectric losses; Heating; Permittivity; Polymers; Voltage measurement; POSS; dielectric response; epoxy; glass transition temperature; interfacial polarization; loss tangent; nanodielectrics; polymer nanocomposites; silica; thermal ageing; volume resistivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on

Conference_Location

Shenzhen

Type

conf

DOI

10.1109/CEIDP.2013.6748268

Filename

6748268