• DocumentCode
    685447
  • Title

    Discussion group summary [5 summaries]

  • fYear
    2013
  • fDate
    13-17 Oct. 2013
  • Firstpage
    197
  • Lastpage
    207
  • Abstract
    The following topics are dealt with: BEOL; reliability of future technologies; reliability challenges for foundries/fabless; RRAM.
  • Keywords
    foundries; integrated circuits; random-access storage; reliability; BEOL; RRAM; back end of line; fabless; foundries; reliability; Electromigration; Foundries; Materials; Reliability; Standards; Stress; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4799-0350-4
  • Type

    conf

  • DOI
    10.1109/IIRW.2013.6804193
  • Filename
    6804193