Investigation on device temperature in open-end winding induction motor drive for alternate Fixed-Bias Inverter scheme

Author

Pradabane, Srinivasan

Author_Institution

Dept. of Electr. Eng., Nat. Inst. of Technol., Warangal, India

fYear

2013

fDate

12-14 Dec. 2013

Firstpage

498

Lastpage

502

Abstract

This paper investigates the rise in junction temperature in power semiconductor devices that occur due to the alternate Fixed-Bias Inverter SVPWM switching scheme for an open-end winding induction motor drive. The PWM scheme considered here uses only instantaneous phase reference voltages. The inverter losses are estimated for this drive system with this PWM strategy using an existing thermal model. The motor current is computed using d-q model of an open-end winding induction motor and the simulation study was performed using MATLAB/Simulink.

Keywords

PWM invertors; induction motor drives; machine windings; power semiconductor devices; PWM scheme; d-q model; fixed-bias inverter SVPWM switching scheme; junction temperature; open-end winding induction motor drive; power semiconductor devices; thermal model; Clamps; Induction motor drives; Inverters; Pulse width modulation; Switches; Vectors; Windings; fixed-bias; junction temperature; open-end winding; space vector modulation; thermal evaluation;

fLanguage

English

Publisher

ieee

Conference_Titel

Green Computing, Communication and Conservation of Energy (ICGCE), 2013 International Conference on

Conference_Location

Chennai

Type

conf

DOI

10.1109/ICGCE.2013.6823488

Filename

6823488