• DocumentCode
    6905
  • Title

    Multifunction Behavior of a Vertical MOSFET With Trench Body Structure and New Erase Mechanism for Use in 1T-DRAM

  • Author

    Jyi-Tsong Lin ; Po-Hsieh Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
  • Volume
    61
  • Issue
    9
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    3172
  • Lastpage
    3178
  • Abstract
    A multifunctional vertical silicon-on-insulator-based metal-oxide-semiconductor (VSoI-MOS) field-effect transistor with trench body structure was designed. It can act as a high-performance transistor (HPT) or a capacitorless one-transistor dynamic random access memory (1T-DRAM), depending on the drain/source location and its electrical and transient performances. The VSoI-MOS operated in HPT mode exhibits favorable electrical performance with a lower drain-induced barrier lowering and subthreshold swing; the same device when operated in the 1T-DRAM mode exhibits a clear kink effect in its output characteristics, which facilitates the appearance of floating body effect and a significant improvement in the transient characteristics compared with HPT mode. This paper proposes a new erase mechanism for the 1T-DRAM mode. The mechanism is studied in detail by exploiting the self-heating of holes.
  • Keywords
    DRAM chips; MOSFET; field effect transistors; silicon-on-insulator; 1T-DRAM; HPT; VSoI-MOS field-effect transistor; capacitorless one-transistor dynamic random access memory; drain-source location; electrical performance; floating body effect; high-performance transistor; hole self-heating; kink effect; lower drain-induced barrier; multifunction behavior; multifunctional vertical silicon-on-insulator-based metal-oxide-semiconductor field-effect transistor; new erase mechanism; subthreshold swing; transient characteristics; transient performance; trench body structure; vertical MOSFET; Body regions; Impact ionization; Performance evaluation; Silicon; Temperature; Transient analysis; Transistors; Capacitorless one-transistor dynamic random access memory (1T-DRAM); multifunction; silicon-on-insulator (SoI) technology; trench body structure;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2336533
  • Filename
    6869035