Title :
Small Counter Bore Diameter Automatic Measurement System
Author :
Yao Zhang ; Xiaoya Liu
Author_Institution :
Comput. & Commun. Eng. Coll., Northeastern Univ. at Qinhuangdao, Qinhuangdao, China
Abstract :
Deep hole diameter measurement questions are difficult at home and abroad, the current measurement method has the disadvantages of slow measuring speed and low precision. As the aperture decreasing, the measurement would be more difficult and the accuracy would be reduced. According to the above conditions, the noncontact measurement method based on the capacitance sensor is given out. The method can effectively improve the efficiency and accuracy of measurement. CCD combines with the 2-D micro-adjustment completes the function of precise positioning. Modular circuits make the signal integrity and accurate. LABVIEW software completes the function of controlling the system automatically, data acquisition and error correction. The experiments show that the scope of the whole system can be from Φ2.4mm to Φ7mm, the maximum resolution can be up to 0.5um, the highest precision can be up to 5um and linearity can be achieved 0.6018%. So the system can achieve nanometer measurement requirements.
Keywords :
capacitive sensors; charge-coupled devices; data acquisition; diameter measurement; error correction; microsensors; velocity measurement; virtual instrumentation; 2D microadjustment; LABVIEW software; capacitance sensor; data acquisition; deep hole diameter measurement; error correction; modular circuit; nanometer measurement requirement; noncontact measurement method; signal integrity; small counter bore diameter automatic measurement system; speed measurement; Apertures; Calibration; Capacitance; Capacitance measurement; Dielectric measurement; Electrodes; Measurement uncertainty; Capacitance sensor; Data acquisition; Error correction; Nano-metrology; Non-contact measurement;
Conference_Titel :
Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
Conference_Location :
Shenyang
DOI :
10.1109/IMCCC.2013.9