• DocumentCode
    691009
  • Title

    Single-Chip Integrated 3-D Hall Sensor

  • Author

    Hongbing Pan ; Leyu Yao ; Shuzhuan He ; Wei Li ; Li Li ; Jing Sha

  • Author_Institution
    Sch. of Electron. Sci. & Eng., Nanjing Univ., Nanjing, China
  • fYear
    2013
  • fDate
    21-23 Sept. 2013
  • Firstpage
    252
  • Lastpage
    255
  • Abstract
    A single-chip three-dimensional(3-D)Hall sensor for high-accuracy three-axis magnetic-field measurements is presented. The chip contains a 3-D Hall device, the analog signal conditioning circuit, an A/D converter and the digital signal-processing unit. The 3-D Hall device contains horizontal and vertical Hall elements. The horizontal Hall element measures the perpendicular component, and four vertical Hall elements measure the two in-plane components of a magnetic flux. With the detailed analysis of the essential factors affecting Hall voltage, the signal conditioning circuit based on spinning current technique is provided, which works in 100kHz and can cancel the offset, reduce the 1/f noise and amplify the signal. The digital signal-processing unit provides the high-accuracy mapping algorithm between measured values and target values.
  • Keywords
    1/f noise; Hall effect transducers; analogue-digital conversion; magnetic field measurement; magnetic flux; magnetic sensors; signal conditioning circuits; signal processing equipment; 1/f noise reduction; A/D converter; Hall voltage; analog signal conditioning circuit; digital signal-processing unit; frequency 100 kHz; high-accuracy mapping algorithm; horizontal Hall element; magnetic flux; signal amplification; single-chip integrated 3D Hall sensor; single-chip three-dimensional Hall sensor; spinning current technique; three-axis magnetic-field measurement; vertical Hall element; CMOS integrated circuits; CMOS technology; Magnetic field measurement; Magnetic flux density; Magnetic sensors; Semiconductor device measurement; 3-D Hall sensor; CMOS sensor; Magnetic sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
  • Conference_Location
    Shenyang
  • Type

    conf

  • DOI
    10.1109/IMCCC.2013.60
  • Filename
    6840449