DocumentCode
691135
Title
In-Situ Temperature Monitoring and Deposition Induced Errors Calibration in Metal-Organic Chemical Vapor Deposition
Author
Dong Yan ; Shing Man Lee ; Longmao Ye ; Linzi Wang ; Jianpeng Liu ; Yuwen Sun
Author_Institution
Key Lab. of Microelectron. Devices & Integrated Technol., Beijing, China
fYear
2013
fDate
21-23 Sept. 2013
Firstpage
897
Lastpage
900
Abstract
In the process of semiconductor layer growth by metal-organic chemical vapor deposition (MOCVD), temperature measurement errors occur due to deposition on the reactor view port. This temperature shift is detrimental for the fabrication of devices. In this paper, an in-situ temperature and reflectance measurement system is developed for real time observations of process temperature and characterization of growing films. Then, a dynamic correction factor is introduced in the thermal radiance equations to eliminate the deposition induced errors. Marathon process run result verifies the effect. Such an on-line self-calibrating procedure would help improve the yield of temperature sensitive epitaxial growth.
Keywords
MOCVD; calibration; measurement errors; semiconductor device measurement; semiconductor epitaxial layers; semiconductor growth; temperature measurement; MOCVD; deposition induced errors; dynamic correction factor; growing films characterization; in-situ temperature measurement system; marathon process run; metal-organic chemical vapor deposition; online self-calibrating procedure; process temperature; reactor view port deposition; real time observations; reflectance measurement system; semiconductor layer growth; temperature measurement errors; temperature sensitive epitaxial growth; temperature shift; thermal radiance equations; Epitaxial growth; Microelectronics; Reflectivity; Semiconductor device measurement; Temperature; Temperature measurement; Temperature sensors; calibration; in-situ monitoring; metal-organic chemical vapor deposition; temperature errors;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
Conference_Location
Shenyang
Type
conf
DOI
10.1109/IMCCC.2013.199
Filename
6840589
Link To Document