• DocumentCode
    691135
  • Title

    In-Situ Temperature Monitoring and Deposition Induced Errors Calibration in Metal-Organic Chemical Vapor Deposition

  • Author

    Dong Yan ; Shing Man Lee ; Longmao Ye ; Linzi Wang ; Jianpeng Liu ; Yuwen Sun

  • Author_Institution
    Key Lab. of Microelectron. Devices & Integrated Technol., Beijing, China
  • fYear
    2013
  • fDate
    21-23 Sept. 2013
  • Firstpage
    897
  • Lastpage
    900
  • Abstract
    In the process of semiconductor layer growth by metal-organic chemical vapor deposition (MOCVD), temperature measurement errors occur due to deposition on the reactor view port. This temperature shift is detrimental for the fabrication of devices. In this paper, an in-situ temperature and reflectance measurement system is developed for real time observations of process temperature and characterization of growing films. Then, a dynamic correction factor is introduced in the thermal radiance equations to eliminate the deposition induced errors. Marathon process run result verifies the effect. Such an on-line self-calibrating procedure would help improve the yield of temperature sensitive epitaxial growth.
  • Keywords
    MOCVD; calibration; measurement errors; semiconductor device measurement; semiconductor epitaxial layers; semiconductor growth; temperature measurement; MOCVD; deposition induced errors; dynamic correction factor; growing films characterization; in-situ temperature measurement system; marathon process run; metal-organic chemical vapor deposition; online self-calibrating procedure; process temperature; reactor view port deposition; real time observations; reflectance measurement system; semiconductor layer growth; temperature measurement errors; temperature sensitive epitaxial growth; temperature shift; thermal radiance equations; Epitaxial growth; Microelectronics; Reflectivity; Semiconductor device measurement; Temperature; Temperature measurement; Temperature sensors; calibration; in-situ monitoring; metal-organic chemical vapor deposition; temperature errors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
  • Conference_Location
    Shenyang
  • Type

    conf

  • DOI
    10.1109/IMCCC.2013.199
  • Filename
    6840589