Wetting behavior of lead-free solders on copper substrates

Author

Satyanarayan ; Prabhu, K.N.

Author_Institution

Dept. of Metall. & Mater. Eng., Nat. Inst. of Technol., Surathkal, India

fYear

2013

fDate

27-28 Sept. 2013

Firstpage

1

Lastpage

5

Abstract

The effect of substrate surface roughness on the wetting behavior of Sn-0.7Cu and Sn-0.3Ag-0.7Cu solder alloys on copper (Cu) substrates was investigated. The contact angles of both solder alloys decreased with increase in substrate surface roughness. The exponential power law (EPL), φ = exp (-Kτ ⁿ), was used to model the relaxation behaviour of solders. Solder spreading kinetics was successfully represented by the (EPL). EPL parameters (K and n) alloy decreased with an increase in surface roughness. Spreading of solder alloys on both substrates exhibited capillary, gravity and viscous regimes. High spreading rates in the capillary regime, moderate in gravity regime and almost constant rates in viscous regimes were observed.

Keywords

capillarity; contact angle; copper; copper alloys; silver alloys; soldering; solders; substrates; surface roughness; tin alloys; viscosity; wetting; SnAgCu-Cu; SnCu-Cu; capillary; contact angles; copper substrates; exponential power law; gravity; high spreading rates; lead-free solders; relaxation behaviour; solder spreading kinetics; substrate surface roughness effect; viscous regimes; wetting behavior; EPL; Lead-free solders; contact angle; wetting;

fLanguage

English

Publisher

iet

Conference_Titel

Research & Technology in the Coming Decades (CRT 2013), National Conference on Challenges in

Conference_Location

Ujire

Electronic_ISBN

978-1-84919-868-4

Type

conf

DOI

10.1049/cp.2013.2550

Filename

6851597