• DocumentCode
    692610
  • Title

    Simple and accurate capacitance modeling of 32nm multi-fin FinFET

  • Author

    Donghu Kim ; Yesung Kang ; Myunghwan Ryu ; Youngmin Kim

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
  • fYear
    2013
  • fDate
    17-19 Nov. 2013
  • Firstpage
    392
  • Lastpage
    393
  • Abstract
    In this paper, we investigate capacitive effect of multi-fins FinFET using the TCAD simulations. The analysis of the capacitance change is performed for the fin pitch and height variation in 32nm single gate FinFET. The analysis results show, as expected, that the increasing fin pitch (Pfin) variation leads to decrease in the coupling capacitance. And increasing height of the fin (Hfin) leads to increase in the capacitive coupling and total gate capacitances. Simple and accurate coupling capacitance models for both pitch and height variations of the three fins FinFET are proposed and verified with TCAD results.
  • Keywords
    MOSFET; electronic engineering computing; technology CAD (electronics); TCAD simulations; coupling capacitance models; fin pitch; height variation; multifins FinFET; pitch variations; single gate FinFET; size 32 nm; total gate capacitances; Capacitance; Couplings; FinFETs; Immune system; Logic gates; Radio frequency; Solid modeling; Multi-fins FinFET; coupling capacitance; fin height; fin pith; single-gate FinFET; variation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2013 International
  • Conference_Location
    Busan
  • Type

    conf

  • DOI
    10.1109/ISOCC.2013.6864059
  • Filename
    6864059