DocumentCode
692610
Title
Simple and accurate capacitance modeling of 32nm multi-fin FinFET
Author
Donghu Kim ; Yesung Kang ; Myunghwan Ryu ; Youngmin Kim
Author_Institution
Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
fYear
2013
fDate
17-19 Nov. 2013
Firstpage
392
Lastpage
393
Abstract
In this paper, we investigate capacitive effect of multi-fins FinFET using the TCAD simulations. The analysis of the capacitance change is performed for the fin pitch and height variation in 32nm single gate FinFET. The analysis results show, as expected, that the increasing fin pitch (Pfin) variation leads to decrease in the coupling capacitance. And increasing height of the fin (Hfin) leads to increase in the capacitive coupling and total gate capacitances. Simple and accurate coupling capacitance models for both pitch and height variations of the three fins FinFET are proposed and verified with TCAD results.
Keywords
MOSFET; electronic engineering computing; technology CAD (electronics); TCAD simulations; coupling capacitance models; fin pitch; height variation; multifins FinFET; pitch variations; single gate FinFET; size 32 nm; total gate capacitances; Capacitance; Couplings; FinFETs; Immune system; Logic gates; Radio frequency; Solid modeling; Multi-fins FinFET; coupling capacitance; fin height; fin pith; single-gate FinFET; variation;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2013 International
Conference_Location
Busan
Type
conf
DOI
10.1109/ISOCC.2013.6864059
Filename
6864059
Link To Document