Title :
A test probe for TSV using resonant inductive coupling
Author :
Rashidzadeh, R. ; Basith, Iftekhar
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Windsor, Windsor, ON, Canada
Abstract :
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
Keywords :
equivalent circuits; integrated circuit testing; three-dimensional integrated circuits; contactless TSV probe; distance 15 mum; equivalent circuits; resonant inductive coupling; test probe; through-silicon-via; Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
Conference_Titel :
Test Conference (ITC), 2013 IEEE International
Conference_Location :
Anaheim, CA
DOI :
10.1109/TEST.2013.6874619
