• DocumentCode
    692883
  • Title

    Enabling fair pricing on HPC systems with node sharing

  • Author

    Breslow, Alex D. ; Tiwari, Anish ; Schulz, Markus ; Carrington, Laura ; Lingjia Tang ; Mars, Jason

  • Author_Institution
    Univ. of California, San Diego, La Jolla, CA, USA
  • fYear
    2013
  • fDate
    17-22 Nov. 2013
  • Firstpage
    1
  • Lastpage
    12
  • Abstract
    Co-location, where multiple jobs share compute nodes in large-scale HPC systems, has been shown to increase aggregate throughput and energy efficiency by 10 to 20%. However, system operators disallow co-location due to fair-pricing concerns, i.e., a pricing mechanism that considers performance interference from co-running jobs. In the current pricing model, application execution time determines the price, which results in unfair prices paid by the minority of users whose jobs suffer from co-location. This paper presents POPPA, a runtime system that enables fair pricing by delivering precise online interference detection and facilitates the adoption of supercomputers with co-locations. POPPA leverages a novel shutter mechanism - a cyclic, fine-grained interference sampling mechanism to accurately deduce the interference between co-runners - to provide unbiased pricing of jobs that share nodes. POPPA is able to quantify inter-application interference within 4% mean absolute error on a variety of co-located benchmark and real scientific workloads.
  • Keywords
    parallel machines; parallel processing; HPC systems; POPPA; fair pricing; fine-grained interference sampling mechanism; interference reduction; node sharing; runtime system; shutter mechanism; supercomputers; Abstracts; Logic gates; Pricing; Supercomputers; Chip Multiprocessor; Contention; Online Pricing; Resource Sharing; Supercomputer Accounting;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computing, Networking, Storage and Analysis (SC), 2013 International Conference for
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4503-2378-9
  • Type

    conf

  • DOI
    10.1145/2503210.2503256
  • Filename
    6877470