• DocumentCode
    693013
  • Title

    Research on SRAM-based FPGA SEE sensitive parameters fast estimation method

  • Author

    Yang Daoning ; He Wei ; Yang Jun ; Xing Kefei

  • Author_Institution
    Coll. of Mechatron. Eng. & Autom., Nat. Univ. of Defense Technol., Changsha, China
  • fYear
    2013
  • fDate
    20-22 Dec. 2013
  • Firstpage
    2735
  • Lastpage
    2738
  • Abstract
    Sensitive parameters (function error rate and mean time to failure (MTTF)) estimation for SRAM-based FPGA Single Event Effect (SEE) has been a very active area of research for recent years. Since the existed methods are time-consuming and costly, a fast estimation method based on fault injection has been proposed to reduce the estimation time. By compressing the fault set, reducing fault injection time and estimating fault response time, the sensitive parameters estimation time has been decreased effectively. The results of the method analysis show that the method this paper proposed can solved the issue of time explosion commendably and obtain accurate target parameters. At present, this method has been applied to the design of a digital signal processing platform in satellite.
  • Keywords
    SRAM chips; aerospace computing; artificial satellites; field programmable gate arrays; parameter estimation; signal processing; MTTF parameter; SRAM-based FPGA SEE sensitive parameters; digital signal processing platform; fast parameter estimation method; fault injection; fault injection time reduction; fault response time estimation; fault set compression; field programmable gate array; function error rate parameter; mean time-to-failure parameter; single event effect; static random access memory; Aerospace electronics; Educational institutions; Error analysis; Field programmable gate arrays; Mathematical model; Monitoring; Single event upsets; SRAM-based FPGA; Single Event Effect (SEE); fault injection; sensitivity test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
  • Conference_Location
    Shengyang
  • Print_ISBN
    978-1-4799-2564-3
  • Type

    conf

  • DOI
    10.1109/MEC.2013.6885492
  • Filename
    6885492