• DocumentCode
    694065
  • Title

    Elimination of waste through value Add/Non value add process analysis to improve cost productivity in manufacturing — A case study

  • Author

    Ng, K.C. ; Lim, Chee Peng ; Chong, Katie E. ; Goh, G.G.G.

  • Author_Institution
    Infineon Technol., Batu Berendam, Malaysia
  • fYear
    2013
  • fDate
    10-13 Dec. 2013
  • Firstpage
    410
  • Lastpage
    414
  • Abstract
    Value Stream Mapping (VSM) is a very comprehensive tool to that allows an organization to identify sources of waste and implements process improvements. This paper describes the adoption of VSM in a semiconductor manufacturing company to improve personnel efficiency and optimize headcount in the production lines. Based on the future state of the value stream mapping a new production process flow was implemented. Non value added activities were reduced or removed by assigning butterfly operators to perform these tasks. The new system successfully resulted in the reduction of six headcounts in the taping process. This is equivalent to a saving of approximately eighty seven thousand Malaysian ringgits per annum. This systematic approach can be similarly employed by the lean practitioners to conduct lean activities in other manufacturing sectors.
  • Keywords
    industrial waste; personnel; productivity; semiconductor industry; value engineering; waste reduction; Malaysian ringgits; VSM; butterfly operators; cost productivity; manufacturing sectors; personnel efficiency; production lines; semiconductor manufacturing company; value add-nonvalue add process analysis; value stream mapping; waste elimination; Companies; Lead; Manufacturing; Personnel; Productivity; Productivity and Value added/Non Value Added Analysis; Semiconductor industry; Value stream mapping (VSM);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2013 IEEE International Conference on
  • Conference_Location
    Bangkok
  • Type

    conf

  • DOI
    10.1109/IEEM.2013.6962444
  • Filename
    6962444