• DocumentCode
    69789
  • Title

    Multifunctional Integrated Sensors for Multiparameter Monitoring Applications

  • Author

    Roozeboom, Clifton L. ; Hill, Bridget E. ; Vu Anh Hong ; Chae Hyuck Ahn ; Ng, Eldwin J. ; Yushi Yang ; Kenny, Thomas W. ; Hopcroft, Matthew A. ; Pruitt, Beth L.

  • Author_Institution
    Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
  • Volume
    24
  • Issue
    4
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    810
  • Lastpage
    821
  • Abstract
    We present multifunctional integrated sensors (MFISES) that combine temperature, humidity, pressure, air speed, chemical gas, magnetic, and acceleration sensing on a single 2-mm × 2-mm die. We fabricate the MFISES in a wafer scale encapsulation process to hermetically seal the sensor functions with moving parts at low vacuum, and then surface micromachine the environmental sensors on top of the sealed layer. The encapsulation process provides very stable conditions for the pressure, magnetic, and acceleration sensors, and enables the deployment of the MFISES in dynamic environmental conditions without special postprocess packaging. We quantify the performance requirements for sensor applications in weather stations, indoor climate control, road activity monitoring, chemical sensing, and parking monitoring. We compare the performance of the MFISES to the application requirements to demonstrate the utility of an integrated sensor in a wide range of applications.
  • Keywords
    acceleration measurement; encapsulation; environmental factors; gas sensors; hermetic seals; humidity measurement; humidity sensors; magnetic field measurement; magnetic sensors; micromachining; pressure measurement; pressure sensors; temperature measurement; temperature sensors; velocity measurement; MFISES; acceleration sensor; air speed sensor; chemical gas sensor; environmental sensor; hermetically seal; humidity sensor; indoor climate control; magnetic sensor; multifunctional integrated sensor; multiparameter monitoring application; parking monitoring; postprocess packaging; pressure sensor; road activity monitoring; surface micromachining; temperature sensor; wafer scale encapsulation process; weather station; Chemical sensors; Magnetic sensors; Monitoring; Temperature measurement; Temperature sensors; Vehicles; Internet of things; MEMS; Sensor systems; microsystems; sensor fusion;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2349894
  • Filename
    6898807