DocumentCode
70168
Title
Investigation of Orthogonal Experiment for Fabrication of a Soldering Joint for a 4-T HTS Coil
Author
Feng Zhou ; Junsheng Cheng ; Ying Xu ; Shousen Song ; Yinming Dai ; Qiuliang Wang
Author_Institution
Inst. of Electr. Eng., Beijing, China
Volume
24
Issue
5
fYear
2014
fDate
Oct. 2014
Firstpage
1
Lastpage
5
Abstract
The joining process of individual BSCCO conductors is inevitable because the double pancake coils need to be connected with each other. Since the resistance characteristics of the joint can affect the stability of nuclear magnetic resonance system seriously, we did a research on soldering joint in this paper. As resistance characteristics of a soldering joint can vary with conditions such as joint length, thickness, temperature, and so on, we conducted short sample joint experiments with orthogonal experimental design. The significance of each condition´s influence was quantitatively calculated, and an appropriate soldering condition was put forward, under which the lowest joint resistance can be obtained. We also applied this appropriate soldering condition to fabricate joints for a 4-T high-temperature superconductivity coil and tested its practical electrical properties.
Keywords
high-temperature superconductors; soldering; superconducting coils; 4-T high-temperature superconductivity coil; double pancake coils; electrical properties; individual BSCCO conductors; joining process; lowest joint resistance; nuclear magnetic resonance system; orthogonal experimental design; resistance characteristics; short sample joint experiments; soldering joint; Bismuth compounds; Coils; Critical current density (superconductivity); High-temperature superconductors; Joints; Resistance; Soldering; BSCCO; electrical properties; high-temperature superconductivity (HTS) coil; orthogonal experiment; soldering joint;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2014.2331452
Filename
6844012
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