DocumentCode
707167
Title
[Front cover]
fYear
2015
fDate
15-19 March 2015
Abstract
The following topics are dealt with: semiconductor thermal measurement and management in harsh environments; modeling and characterization for integrated circuits; measurements and characterization of advanced materials; computational fluid dynamics analysis; heat transfer; quality and reliability.
Keywords
computational fluid dynamics; heat measurement; heat transfer; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; thermal management (packaging); computational fluid dynamics; harsh environments; heat transfer; integrated circuit characterization; integrated circuit modeling; reliability; semiconductor thermal management; semiconductor thermal measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location
San Jose, CA
ISSN
1065-2221
Type
conf
DOI
10.1109/SEMI-THERM.2015.7100114
Filename
7100114
Link To Document