DocumentCode
707173
Title
Sensor placement for surface temperature control in thin mobile form factors
Author
Biber, Cathy
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
2015
fDate
15-19 March 2015
Firstpage
31
Lastpage
36
Abstract
Thin mobile form factors are primarily passively cooled. Because the outer case is the main heat rejection area, total dissipation capability is limited by user perception of touch temperature. The platform dissipation can only temporarily exceed this limit and may need to be controlled. Internal sensors are inexpensive proxies for surface hot spots. This paper describes best practices for locating internal sensors to represent outer surface temperature.
Keywords
cooling; sensor placement; temperature control; temperature sensors; passive cooling; sensor placement; surface temperature control; thin mobile form factors; Heating; Surface treatment; Temperature distribution; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location
San Jose, CA
ISSN
1065-2221
Type
conf
DOI
10.1109/SEMI-THERM.2015.7100135
Filename
7100135
Link To Document