• DocumentCode
    707191
  • Title

    Anemometric tool for air flow rate measurement through perforated tiles in a raised floor data center

  • Author

    Arghode, Vaibhav K. ; Taegyu Kang ; Joshi, Yogendra ; Phelps, Wally ; Michaels, Murray

  • Author_Institution
    George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2015
  • fDate
    15-19 March 2015
  • Firstpage
    163
  • Lastpage
    171
  • Abstract
    In a raised floor data center, cold air from a pressurized sub-floor plenum reaches the data center room space through perforated floor tiles. Presently, commercially available tool "Flow Hood" (also known as "Balometer") is used to measure the air flow rate through the tiles. In the present paper, we will discuss the operating principle and the shortcomings of the commercial tool and will investigate a simple tile air flow rate measurement tool having an array of thermal anemometers (here termed as "Anemometric Tool"). The performance of both the tools is compared for different types of tiles (passive and active) for a wide range of tile air flow rates. It is found that the Anemometric Tool results in lower flow rate measurement uncertainty and works more effectively for high porosity tiles, as compared to the commercial tool Flow Hood.
  • Keywords
    air conditioning; anemometry; computer centres; floors; flow measurement; tiles; Flow Hood; air flow rate measurement; anemometric tool; balometer; data center room space; perforated tiles; pressurized subfloor plenum; raised floor data center; thermal anemometers; tile air flow rate measurement tool; Electrical resistance measurement; Floors; Fluid flow measurement; Measurement uncertainty; Pressure measurement; Resistance; Temperature measurement; Anemometric tool; Data center cooling; Flowhood; Perforated floor tiles; Tile air flow rate measurement; Tool resistance compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2015.7100155
  • Filename
    7100155