DocumentCode
708076
Title
Modeling of LED solder joint cracking during temperature cycling with Finite Element
Author
Yuan, W. ; Altieri-Weimar, P.
Author_Institution
Osram Opto Semicond. GmbH, Regensburg, Germany
fYear
2015
fDate
19-22 April 2015
Firstpage
1
Lastpage
5
Abstract
In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.
Keywords
finite element analysis; light emitting diodes; solders; thermal management (packaging); FE-model; LED solder joint cracking; cohesive zone modeling; crack growth model; finite element; shear test data; solder creep simulation; solder joint reliability; temperature cycling; Deformable models; Force; Joints; Light emitting diodes; Load modeling; Predictive models; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location
Budapest
Print_ISBN
978-1-4799-9949-1
Type
conf
DOI
10.1109/EuroSimE.2015.7103105
Filename
7103105
Link To Document