Prediction of package delamination based on μMMT and BST experiments

The numerical simulation and prediction of interfacial delamination in electronic packages using the finite element method requires a correct understanding of the failure and an accurate characterization of the materials involved at the interface. In this work, experiments were realized to characterize the interfacial adhesion and fracture toughness of copper-to-epoxy-molding-compound interfaces. Adhesion parameters for different combinations of coppers and molding compounds were extracted from the so-called micro mixed mode test (μMMT) and button shear test (BST). Finite element simulations using cohesive zone modeling (CZM) were used to predict the delamination behavior of different micro-electronic packages being subjected to half cycle tests. The results of the numerical simulation and prediction were verified experimentally.