A finite element modelling and fracture mechanical approach of Multilayer Ceramic Capacitors

Author

Al Ahmar, Joseph ; Wiese, Steffen

Author_Institution

Saarland Univ., Saarbrücken, Germany

fYear

2015

fDate

19-22 April 2015

Firstpage

1

Lastpage

5

Abstract

A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.

Keywords

brittle fracture; ceramic capacitors; finite element analysis; fracture mechanics; microcracks; reliability; soldering; thermal shock; ANSYS; board flexing; brittle material behavior; ceramic termination interface; component reliability; finite element model; fracture mechanics; fracture parameters; microcracking; multilayer ceramic capacitors; solder reflow; thermal shock; Kinematics; Load modeling; Temperature; Thermal conductivity; Thermal expansion; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on

Conference_Location

Budapest

Print_ISBN

978-1-4799-9949-1

Type

conf

DOI

10.1109/EuroSimE.2015.7103147

Filename

7103147