• DocumentCode
    709022
  • Title

    Modal expansion basis for statistical estimation of maximum expected field strength in enclosures

  • Author

    Bremner, Paul G.

  • Author_Institution
    Robust Phys., Del Mar, CA, USA
  • fYear
    2015
  • fDate
    15-21 March 2015
  • Firstpage
    46
  • Lastpage
    51
  • Abstract
    Estimating the electromagnetic field strength in avionics boxes at high frequencies and in electrically large enclosures such as launch vehicle payload fairings is often impractical using a “full wave” numerical model. The ratio of wavelength to characteristic dimensions is such that both temporal and spatial field response is highly sensitive to small geometric details which are typically not known or not practical to model. However, the statistical distribution of such a chaotic wavefield collapses uniformly to a convenient two parameter probability distribution. This paper reduces a deterministic modal expansion of electric field in an enclosure, to show the basis for a simple statistical model which can predict both the spatio-temporal mean response and the maximum expected response, for any required statistical confidence level. The paper compares preliminary predictions of the statistical model with experimental data from reverberation chamber tests at NASA LaRC.
  • Keywords
    aerospace testing; avionics; electromagnetic interference; electronics packaging; estimation theory; immunity testing; statistical analysis; NASA; avionics box; electric field deterministic modal expansion; electrically large enclosures; electromagnetic field strength; full wave numerical model; launch vehicle payload fairing; maximum expected field strength; modal expansion basis; reverberation chamber tests; statistical estimation; Cavity resonators; Electric fields; Frequency measurement; NIST; Reactive power; Resonant frequency; Shape; Maximum expected field strength; Reverberant field; Statistical electromagnetics; Stochastic model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-1992-5
  • Type

    conf

  • DOI
    10.1109/EMCSI.2015.7107657
  • Filename
    7107657