Title :
Table of contents
Abstract :
The following topics are dealt with: 3DIC packaging; interconnection; medical devices; thermal management; biomimetics; substrate and interposers; IoT; killer devices; printed electronics; N-MEMS; power electronics integration; and optoelectronics.
Keywords :
Internet of Things; biomedical electronics; biomimetics; integrated circuit interconnections; integrated circuit packaging; micromechanical devices; nanoelectromechanical devices; optoelectronic devices; power electronics; substrates; thermal management (packaging); three-dimensional integrated circuits; 3DIC packaging; IoT; N-MEMS; biomimetics; interconnection; interposers; killer devices; medical devices; optoelectronics; power electronics integration; printed electronics; substrate; thermal management;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7110996
