DocumentCode
709571
Title
Table of contents
fYear
2015
fDate
14-17 April 2015
Firstpage
1
Lastpage
21
Abstract
The following topics are dealt with: 3DIC packaging; interconnection; medical devices; thermal management; biomimetics; substrate and interposers; IoT; killer devices; printed electronics; N-MEMS; power electronics integration; and optoelectronics.
Keywords
Internet of Things; biomedical electronics; biomimetics; integrated circuit interconnections; integrated circuit packaging; micromechanical devices; nanoelectromechanical devices; optoelectronic devices; power electronics; substrates; thermal management (packaging); three-dimensional integrated circuits; 3DIC packaging; IoT; N-MEMS; biomimetics; interconnection; interposers; killer devices; medical devices; optoelectronics; power electronics integration; printed electronics; substrate; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7110996
Filename
7110996
Link To Document