DocumentCode
709576
Title
Advantage of direct etching method and process integration for TSV reliability
Author
Sakuishi, Toshiyuki ; Murayama, Takahiro ; Morikawa, Yasuhiro
Author_Institution
ULVAC Inc. Inst. of Semicond. & Electron. Technol., Shizuoka, Japan
fYear
2015
fDate
14-17 April 2015
Firstpage
69
Lastpage
73
Abstract
Cost and reliability of TSV has become a challenge to mass production. Scallop free and tapered etch by direct etching method improve the coverage of deposition and reliability of cu electro plating. Taper angle controllability of direct etching method expands the possibility of TSV process integration.
Keywords
copper alloys; electroplating; etching; integrated circuit reliability; three-dimensional integrated circuits; Cu; TSV cost; TSV reliability; copper electroplating; direct etching method; mass production; process integration; scallop free etch; taper angle controllability; tapered etch; Antennas; Controllability; Etching; Iterative closest point algorithm; Plasmas; Reliability; Direct etching; Dry etch; ICP; Scalopp-free; TSV;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111003
Filename
7111003
Link To Document