DocumentCode :
709582
Title :
Development of nanocavity sealing process for MEMS optical interferometric biosensor
Author :
Takahashi, Kazuhiro ; Masuya, Yoshihiro ; Ozawa, Ryo ; Ishida, Makoto ; Sawada, Kazuaki
Author_Institution :
Toyohashi Univ. of Technol., Toyohashi, Japan
fYear :
2015
fDate :
14-17 April 2015
Firstpage :
120
Lastpage :
123
Abstract :
This paper reports a MEMS-based Fabry-Perot interferometric biosensor that utilizes an optical transmittance change via Fabry-Perot interference to enhance the conversion efficiency from the mechanical displacement to electrical readout. The novel signal transducing technique was performed in three steps, namely, mechanical deflection, transmittance change, and photocurrent change. The newly proposed flat sensor structure with a trench refill provides reliability, robustness, and high yield. The polychloro-para-xylylene thin film was released by XeF2 using a polysilicon sacrificial layer. The etching holes were sealed to prevent any liquid contamination into the Fabry-Perot cavity. A 30-μm-thick photosensitive dry film resist was laminated on the substrate. The sensing area was opened by standard photolithography, exposing UV light using a manual aligner. The interference peak position indicated that the freestanding parylene-C film kept hollow construction without stiction. During the liquid supplying to the sensor, no liquid leakage was observed because output current shows constant. In conclusion, the nanocavity sealing process was successfully demonstrated.
Keywords :
Fabry-Perot interferometers; bioMEMS; biosensors; etching; microfabrication; microsensors; optical sensors; polymer films; ultraviolet lithography; xenon compounds; Fabry-Perot cavity; Fabry-Perot interference; MEMS-based Fabry-Perot interferometric biosensor; UV light; XeF2; conversion efficiency; electrical readout; etching holes; flat sensor structure; freestanding parylene-C film; hollow construction; interference peak position; liquid contamination; manual aligner; mechanical deflection; mechanical displacement; nanocavity sealing process; optical transmittance change; output current; photocurrent change; photosensitive dry film resist; polychloro-para-xylylene thin film; polysilicon sacrificial layer; reliability; robustness; sensing area; signal transducing technique; size 30 mum; standard photolithography; trench refill; Biomedical optical imaging; Biomembranes; Etching; Films; Liquids; Optical interferometry; Optical sensors; Fabry-Perot interference; dry film resist; label-free biosensing; microelectromechanical systems (MEMS); photodiode; surface-stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
Type :
conf
DOI :
10.1109/ICEP-IAAC.2015.7111011
Filename :
7111011
Link To Document :
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