DocumentCode
709607
Title
Experimental study for method to measure terminal part temperature of micro-electronic devices using infrared thermograph and image processing
Author
Hirasawa, Koichi ; Aruga, Yoshinori ; Ohhashi, Yasushi ; Tomimura, Toshio
Author_Institution
KOA Corp., Minowa, Japan
fYear
2015
fDate
14-17 April 2015
Firstpage
377
Lastpage
380
Abstract
Concerning surface mount resistors, which are one of micro electronic devices, measurement of the terminal part temperature measurement is important from the standpoint of thermal management. When the electronic device designer uses the infrared thermograph to measure the approximate value of the terminal part temperature of the surface mount resistor, the surface hotspot of the resistor will form a so striking contrast in the thermograph image that the terminal part will be hard to be measured. The possible method for overcoming this problem is to apply a proper cutoff frequency filter to the obtained temperature distribution image, and then smooth the hotspot of the resistor (locally high temperature portion of resister surface) down near the terminal part temperature level, and finally read this hotspot temperature as the terminal part temperature. The possibility mentioned above will be discussed in this study.
Keywords
image processing; infrared imaging; resistors; semiconductor device measurement; surface mount technology; temperature measurement; thermal management (packaging); cutoff frequency filter; electronic device designer; image processing; infrared thermograph; micro electronic devices; micro-electronic devices; surface hotspot; surface mount resistors; temperature distribution image; terminal part temperature measurement; thermal management; thermograph image; Cutoff frequency; Frequency measurement; Lenses; Resistors; Spatial resolution; Temperature distribution; Temperature measurement; infrared thermograph; resistor; spatial resolution; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111039
Filename
7111039
Link To Document