• DocumentCode
    709607
  • Title

    Experimental study for method to measure terminal part temperature of micro-electronic devices using infrared thermograph and image processing

  • Author

    Hirasawa, Koichi ; Aruga, Yoshinori ; Ohhashi, Yasushi ; Tomimura, Toshio

  • Author_Institution
    KOA Corp., Minowa, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    377
  • Lastpage
    380
  • Abstract
    Concerning surface mount resistors, which are one of micro electronic devices, measurement of the terminal part temperature measurement is important from the standpoint of thermal management. When the electronic device designer uses the infrared thermograph to measure the approximate value of the terminal part temperature of the surface mount resistor, the surface hotspot of the resistor will form a so striking contrast in the thermograph image that the terminal part will be hard to be measured. The possible method for overcoming this problem is to apply a proper cutoff frequency filter to the obtained temperature distribution image, and then smooth the hotspot of the resistor (locally high temperature portion of resister surface) down near the terminal part temperature level, and finally read this hotspot temperature as the terminal part temperature. The possibility mentioned above will be discussed in this study.
  • Keywords
    image processing; infrared imaging; resistors; semiconductor device measurement; surface mount technology; temperature measurement; thermal management (packaging); cutoff frequency filter; electronic device designer; image processing; infrared thermograph; micro electronic devices; micro-electronic devices; surface hotspot; surface mount resistors; temperature distribution image; terminal part temperature measurement; thermal management; thermograph image; Cutoff frequency; Frequency measurement; Lenses; Resistors; Spatial resolution; Temperature distribution; Temperature measurement; infrared thermograph; resistor; spatial resolution; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111039
  • Filename
    7111039