Title :
Measurement of surface roughness dependence of thermal contact resistance under low pressure condition
Author :
Azuma, Kuniya ; Hatakeyama, Tomoyuki ; Nakagawa, Shinji
Author_Institution :
Dept. of Mech. Syst. Eng., Toyama Prefectural Univ., Kurokawa, Japan
Abstract :
Recently, thermal design of electrical equipment is important. Thermal contact resistance is one of the important parameters in the thermal design. However, thermal contact resistance is dependent on various factors, for example surface roughness, the contact pressure and the hardness of the material. Therefore, quantitative evaluation is difficult, and a little information can be obtained under high pressure conditions. In this study, we examine surface roughness and material hardness dependence of thermal contact resistance under low pressure condition. The materials to be measured are Al1070 and S45C, and three patterns (Ra = 0.2, 3.2, 12.5) of surface roughness are examined. Range of the contact pressure is 7.8 - 78 kPa. And, we have investigated the thermal resistance changed by contact pressure. From the experimental results, the reduction rate of the thermal contact resistance by increasing in pressure is dependent on the surface roughness, and thermal resistance of low hardness sample is saturated at higher contact pressure. Further, we discuss the relationship between the contact pressure and thermal resistance by the “Hertzian contact theory”. As a result, we confirm that the experimental results can be approximated by this equation.
Keywords :
contact resistance; surface roughness; surface topography measurement; thermal resistance; Al1070; Hertzian contact theory; S45C; contact pressure; electrical equipment; material hardness dependence; pressure 7.8 kPa to 78 kPa; surface roughness measurement; thermal contact resistance; Contact resistance; Electrical resistance measurement; Rough surfaces; Surface resistance; Surface roughness; Thermal resistance; Hertzian contact theory; surface roughness; thermal contact resistance;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111040