DocumentCode
709683
Title
Optimum configuration of SI/PI Co-Simulation using electro-magnetic simulator
Author
Umekawa, Mitsuharu
Author_Institution
EDA Field Applic. Eng., Keysight Technol. Japan G.K., Hachioji, Japan
fYear
2015
fDate
14-17 April 2015
Firstpage
890
Lastpage
893
Abstract
Signal Integrity (SI) of single-ended digital communication devices, like DDR memory, is directly vulnerable to Power Integrity (PI) issues because the current return path flows from power to ground through the signal lines. Accurate simulation of the interaction between both signal lines and the Power Delivery Network (PDN) is essential for estimating system reliability before fabricating the printed circuit board (PCB). To achieve this goal, electro-magnetic (EM) simulation is commonly used rather than measurement by a vector network analyzer. This simulation approach is possible, but modeling the full PDN with critical signal lines on a large PCB can absorb prohibitive long simulation time given the ever faster design cycles of modern electronics. This paper provides the pros and cons of optimizing the PDN size relative to the signal lines to reduce SI/PI Co-Simulation time for EM solvers. The results of the simulations is validated by measurement and the ideas are extended to more realistic case with deductive approach.
Keywords
circuit optimisation; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; integrated memory circuits; logic design; printed circuit manufacture; DDR memory; EM simulation; EM solvers; PCB; PDN; SI-PI cosimulation; current return path; electromagnetic simulation; electromagnetic simulator; power delivery network; power integrity; printed circuit board; signal integrity; signal lines; single-ended digital communication devices; system reliability; vector network analyzer; Impedance; Integrated circuit modeling; Inverters; Layout; Noise; Silicon; High Speed Board Design; Signal and Power Integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111142
Filename
7111142
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