DocumentCode
709807
Title
A case study of electromigration reliability: From design point to system operations
Author
Baozhen Li ; Muller, Paul ; Warnock, James ; Sigal, Leon ; Badami, Dinesh
Author_Institution
IBM Syst. & Technol. Group, Essex Junction, VT, USA
fYear
2015
fDate
19-23 April 2015
Abstract
While great efforts have been made to counter the EM reliability degradation due to technology scaling, closer cooperation is needed among semiconductor fabricators, circuit/chip designers and system integrators to ensure final product reliability. This paper presents an example of systematic EM reliability evaluation from design point definition to chip design verification, to system characterization, and finally to EM reliability monitoring from in-field operations.
Keywords
electromigration; integrated circuit design; integrated circuit reliability; EM reliability degradation; EM reliability monitoring; chip design verification; design point; electromigration reliability; product reliability; semiconductor fabricators; system characterization; systematic EM reliability evaluation; technology scaling; Chip scale packaging; Integrated circuit reliability; Mathematical model; Reliability engineering; Temperature distribution; Temperature sensors; chip design; electromigration (EM); statistical EM budgeting; system reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IRPS.2015.7112680
Filename
7112680
Link To Document