• DocumentCode
    709807
  • Title

    A case study of electromigration reliability: From design point to system operations

  • Author

    Baozhen Li ; Muller, Paul ; Warnock, James ; Sigal, Leon ; Badami, Dinesh

  • Author_Institution
    IBM Syst. & Technol. Group, Essex Junction, VT, USA
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    While great efforts have been made to counter the EM reliability degradation due to technology scaling, closer cooperation is needed among semiconductor fabricators, circuit/chip designers and system integrators to ensure final product reliability. This paper presents an example of systematic EM reliability evaluation from design point definition to chip design verification, to system characterization, and finally to EM reliability monitoring from in-field operations.
  • Keywords
    electromigration; integrated circuit design; integrated circuit reliability; EM reliability degradation; EM reliability monitoring; chip design verification; design point; electromigration reliability; product reliability; semiconductor fabricators; system characterization; systematic EM reliability evaluation; technology scaling; Chip scale packaging; Integrated circuit reliability; Mathematical model; Reliability engineering; Temperature distribution; Temperature sensors; chip design; electromigration (EM); statistical EM budgeting; system reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112680
  • Filename
    7112680