• DocumentCode
    709817
  • Title

    A method for rapid screening of various low-k TDDB models

  • Author

    Fen Chen ; Graas, Carole ; Shinosky, Michael ; Burke, Chad ; Feng, Kai D. ; Bocash, Craig ; Muralidhar, Ramachandran

  • Author_Institution
    IBM Microelectron., Essex Junction, VT, USA
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    Voltage or Field acceleration model is crucial for low-k TDDB reliability study and lifetime projection. Over the years, many different acceleration models have been proposed based on different physics. In this paper, a method for a relatively fast screen of various low-k TDDB models is proposed. Fast voltage ramp test to establish a relation of JE slope versus stress field is the first step. Study of J-E slopes in advance before time-consuming TDDB could provide insight into TDDB kinetics. Next is to select appropriate stress voltages based on J-E characteristics with high density voltage points but at high and medium stress voltage ranges. Lastly, by proceeding with the local acceleration factor comparison and correlating it to J-E slope versus voltage relation, the most likely and the most unlikely models can effectively be determined within a much shorter period of stress time.
  • Keywords
    electric breakdown; reliability; stress analysis; J-E slope characteristics; acceleration factor; fast voltage ramp testing; field acceleration model; lifetime projection; low-k TDDB reliability study; rapid screening method; stress voltage field; time-dependent dielectric breakdown; voltage acceleration model; Acceleration; Data models; Fitting; Low voltage; Resistance; Standards; Stress; Cu reliability; IR drop; Low-k TDDB; Low-k field acceleration model; local accelration factor; low-k I-V slope; low-k voltage acceleration model; model screening; series resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112697
  • Filename
    7112697