DocumentCode
710322
Title
Time domain response for the fractional order transfer function characterizing the thermal diffusive interface
Author
Assaf, Riad ; Daou, Roy Abi Zeid ; Moreau, Xavier
Author_Institution
IMS Lab., Univ. of Bordeaux, Bordeaux, France
fYear
2015
fDate
April 29 2015-May 1 2015
Firstpage
190
Lastpage
194
Abstract
The time response is one of the main concerns when controlling and analyzing a system. Getting this response for some systems is sometimes difficult especially if the transfer function modelling this system is non-integer or nonlinear. The thermal diffusive interface is an example of such systems. In fact, when considering the semi-infinite homogeneous plane, the time response can be analytically calculated for some particular input functions as the step or the impulse but can´t be determined for any type of inputs. As for the finite homogeneous plane, the time response can´t be found analytically for any input. Hence, this paper presents some novel methods to approach this system and to get the time response with some light approximations on the exact system. The results show that the approximation made in the frequency domain have almost the same behavior of the exact transfer function and the time domain response could be computed, using this approximation, for any input for both thermal systems.
Keywords
computational fluid dynamics; heat transfer; hyperbolic equations; thermal diffusion; transfer functions; computational fluid dynamics; fractional order transfer function characteristics; hyperbolic function; semi-infinite homogeneous plane; thermal diffusive interface; thermal system; time domain response; Approximation methods; Frequency-domain analysis; Mathematical model; Media; Time factors; Time-domain analysis; Transfer functions; approximation; finite plane medium; fractional calculus; frequency response; heat transfer control; semi-infinite plane medium; thermal diffusive interface; time domain response;
fLanguage
English
Publisher
ieee
Conference_Titel
Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE), 2015 Third International Conference on
Conference_Location
Beirut
Print_ISBN
978-1-4799-5679-1
Type
conf
DOI
10.1109/TAEECE.2015.7113625
Filename
7113625
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