• DocumentCode
    710385
  • Title

    SoC test integration platform

  • Author

    Kifli, Augusli ; Wu, K.C.

  • Author_Institution
    Faraday Technol. Corp., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    27-29 April 2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Most of the ASIC designs that we currently encountered are SoC in nature. The success of SoC design methodology relies on the design reuse of existing cores (IPs). The tasks of integrating the cores and creating successful tests for the SoC should not be overlooked. These tasks may need a considerable amount of time from the designers and are inherently error-prone. Conventionally, designers have to understand the test requirement of all the IPs used in the SoC. A test plan is then created and the corresponding test wrapper for the IPs is added and integrated into the SoC design. Besides IPs test integration, designers typically need to plan for the scan DfT, test compression, test wrapper, memory BIST, and boundary scan. The above tasks are pretty standard, yet they are tedious and error-prone.
  • Keywords
    built-in self test; error analysis; logic circuits; microprocessor chips; system-on-chip; ASIC designs; DfT; IP core test integration; SoC design methodology; SoC test integration platform; application specific integrated circuits; boundary scan; built-in self test; error prone; memory BIST; system-on-chip; test compression; test plan; test requirement; test wrapper; Built-in self-test; Clocks; Design methodology; IP networks; Planning; Productivity; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2015.7114546
  • Filename
    7114546