DocumentCode
710385
Title
SoC test integration platform
Author
Kifli, Augusli ; Wu, K.C.
Author_Institution
Faraday Technol. Corp., Hsinchu, Taiwan
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
2
Abstract
Most of the ASIC designs that we currently encountered are SoC in nature. The success of SoC design methodology relies on the design reuse of existing cores (IPs). The tasks of integrating the cores and creating successful tests for the SoC should not be overlooked. These tasks may need a considerable amount of time from the designers and are inherently error-prone. Conventionally, designers have to understand the test requirement of all the IPs used in the SoC. A test plan is then created and the corresponding test wrapper for the IPs is added and integrated into the SoC design. Besides IPs test integration, designers typically need to plan for the scan DfT, test compression, test wrapper, memory BIST, and boundary scan. The above tasks are pretty standard, yet they are tedious and error-prone.
Keywords
built-in self test; error analysis; logic circuits; microprocessor chips; system-on-chip; ASIC designs; DfT; IP core test integration; SoC design methodology; SoC test integration platform; application specific integrated circuits; boundary scan; built-in self test; error prone; memory BIST; system-on-chip; test compression; test plan; test requirement; test wrapper; Built-in self-test; Clocks; Design methodology; IP networks; Planning; Productivity; System-on-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-DAT.2015.7114546
Filename
7114546
Link To Document