DocumentCode
710471
Title
A 25-Gbps operation of polymer-based optical and electrical hybrid LSI package substrate with optical card edge connector
Author
Amano, Takeru ; Ukita, Shigenori ; Egashira, Yoshiyuki ; Sasaki, Mikiko ; Mori, Masahiko ; Kurata, Kazuhiko
Author_Institution
Adv. Ind. Sci. & Technol., Japan
fYear
2015
fDate
20-22 April 2015
Firstpage
114
Lastpage
115
Abstract
We propose a polymer-based optical and electrical hybrid LSI package integrated with silicon photonic chips. We fabricated hybrid package substrate with polymer optical waveguide and card edge connector. We realized a 25-Gbps per channel error-free transmission at 1.3-μm.
Keywords
elemental semiconductors; integrated optics; integrated optoelectronics; large scale integration; optical fabrication; optical interconnections; optical polymers; optical transceivers; optical waveguides; silicon; Si; bit rate 25 Gbit/s; error-free transmission; optical card edge connector; polymer optical waveguide; polymer-based optical-electrical hybrid LSI package substrate; silicon photonic chips; wavelength 1.3 mum; Adaptive optics; Optical device fabrication; Optical fibers; Optical polymers; Optical receivers; Optical transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Interconnects Conference (OI), 2015 IEEE
Conference_Location
San Diego, CA
Print_ISBN
978-1-4799-8178-6
Type
conf
DOI
10.1109/OIC.2015.7115712
Filename
7115712
Link To Document