Title :
Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip
Author :
Yun Wang ; Djordjecvic, Stevan S. ; Jin Yao ; Cunningham, John E. ; Xuezhe Zheng ; Krishnamoorthy, Ashok V. ; Muller, Michael ; Amann, Markus-Christian ; Bojko, Richard ; Jaeger, Nicolas A. F. ; Chrostowski, Lukas
Author_Institution :
Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
Abstract :
We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.
Keywords :
elemental semiconductors; flip-chip devices; integrated circuit bonding; integrated optics; laser cavity resonators; optical directional couplers; optical fabrication; silicon; surface emitting lasers; VCSEL; bidirectional vertical-coupled grating coupler; light coupling; silicon photonics chip; vertical cavity surface emitting laser flip-chip bonding; Bonding; Couplers; Gratings; Optical waveguides; Silicon photonics; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Interconnects Conference (OI), 2015 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4799-8178-6
DOI :
10.1109/OIC.2015.7115716
