• DocumentCode
    712763
  • Title

    An ultra low power 3D integrated intra-chip silicon electronic-photonic link

  • Author

    Timurdogan, Erman ; Zhan Su ; Settaluri, Krishna ; Sen Lin ; Moazeni, Sajjad ; Chen Sun ; Leake, Gerald ; Coolbaugh, Douglas D. ; Moss, Benjamin R. ; Moresco, Michele ; Stojanovic, Vladimir ; Watts, Michael R.

  • Author_Institution
    Res. Lab. of Electron., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2015
  • fDate
    22-26 March 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A record low energy (250fJ/bit) intra-chip electronic-photonic link is demonstrated at 5Gb/s on a 3D-integrated wafer using through-oxide-vias (1.45fF-per-via) for the first time. The receiver sensitivity was -19.3dBm and the on-chip laser energy was 6fJ/bit.
  • Keywords
    elemental semiconductors; integrated optics; low-power electronics; optical links; silicon; three-dimensional integrated circuits; 3D-integrated wafer; Si; bit rate 5 Gbit/s; intrachip electronic-photonic link; on-chip laser energy; receiver sensitivity; through-oxide-vias; ultra low power 3D integration; Detectors; Modulation; Optical transmitters; Photonics; Receivers; Silicon; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communications Conference and Exhibition (OFC), 2015
  • Conference_Location
    Los Angeles, CA
  • Type

    conf

  • Filename
    7122151
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=712763