• DocumentCode
    712841
  • Title

    Current-collapse-free operations up to 850 V by GaN-GIT utilizing hole injection from drain

  • Author

    Kaneko, Saichiro ; Kuroda, Masayuki ; Yanagihara, Manabu ; Ikoshi, Ayanori ; Okita, Hideyuki ; Morita, Tatsuo ; Tanaka, Kenichiro ; Hikita, Masahiro ; Uemoto, Yasuhiro ; Takahashi, Satoru ; Ueda, Tetsuzo

  • Author_Institution
    Eng. Div., Panasonic Corp., Nagaokakyo, Japan
  • fYear
    2015
  • fDate
    10-14 May 2015
  • Firstpage
    41
  • Lastpage
    44
  • Abstract
    Current collapse at high drain voltage in a GaN-based transistor is successfully suppressed by the introduction of p-GaN region which is placed beside the drain of a Gate Injection Transistor (GIT). The additional p-GaN region enables hole injection which effectively releases trapped electrons at around drain region after the application of high drain voltages. The p-GaN region is electrically connected to the drain electrode so that this is named as Hybrid Drain-embedded GIT (HD-GIT). The fabricated HD-GITs are free from current collapse at 850 V of the drain voltage or over, which significantly helps to achieve stable system operations and is very promising for future switching power supply applications.
  • Keywords
    III-V semiconductors; gallium compounds; power field effect transistors; wide band gap semiconductors; GaN; GaN-GIT; GaN-based transistor; current-collapse-free operations; drain region; gate injection transistor; high drain voltages; hole injection; hybrid drain-embedded GIT; p-GaN region; voltage 850 V; Decision support systems; Integrated circuits; Power semiconductor devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
  • Conference_Location
    Hong Kong
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-6259-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.2015.7123384
  • Filename
    7123384