DocumentCode
713428
Title
Experimental investigations of the needle winding technology regarding the influence of the wire guide geometry on the tensile wire force
Author
Stenzel, P. ; Dollinger, P. ; Richnow, J. ; Bader, T. ; Franke, J. ; Endisch, C.
Author_Institution
AUDI AG, Ingolstadt, Germany
fYear
2015
fDate
17-19 March 2015
Firstpage
2642
Lastpage
2649
Abstract
The needle winding technology is distinguished by a high degree of flexibility and automation. However, high wire tension due to the tensile winding force proves to be detrimental. Wire stress can cause an increase of the ohmic winding resistance, thus leading to a decrease of the degree of efficiency and a reduction of the continuous power of an electric machine. A closed-loop-control of the tensile winding force is basically possible, however, the influence of the wire guide on the tensile force cannot be included due to the possible measuring positions. In order to use the automation potential of the needle winding technology it has to be ensured that quality and power of the winding products are not degraded. Therefore the influence of the tensile winding force on ohmic resistance as well as the influence of the geometry of the wire guide on the tensile force has to be known. However, such investigations have either not been conducted so far or are currently not publicly accessible. The winding parameters are usually based on experience, which is not sufficient for high power density applications. Therefore, in this paper experimental investigations are presented concerning the above mentioned topics and potentials for improvement are identified.
Keywords
machine windings; needles; product quality; tensile strength; wires (electric); closed-loop-control; needle winding technology; ohmic winding resistance; tensile winding force; tensile wire force; winding product quality; wire guide geometry; Electrical resistance measurement; Force; Geometry; Needles; Resistance; Windings; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology (ICIT), 2015 IEEE International Conference on
Conference_Location
Seville
Type
conf
DOI
10.1109/ICIT.2015.7125487
Filename
7125487
Link To Document