• DocumentCode
    715926
  • Title

    Is adaptive testing the panacea for the future test problems?

  • Author

    Zebo Peng

  • Author_Institution
    Embedded Syst. Lab. (ESLAB), Linkoping Univ., Linkoping, Sweden
  • fYear
    2015
  • fDate
    25-29 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    With the development of silicon technology and safety-critical applications, the test community is facing many new challenges. In particular, there are many emerging test problems associated with the ever-increasing process variation in the silicon manufacturing process. Adaptive testing has been proposed as a solution to many of these test problems. This panel will debate on what adaptive testing techniques can and can´t do as well as the interesting problems and research issues in this area. In a general sense, adaptive testing techniques include all approaches that modify the test configuration, condition, flow, stimuli, and constraints dynamically based on data collected during the test process. We will assume this general definition of adaptive testing and discuss the following questions in this panel: - What test problems can be uniquely solved by adaptive testing? - Is adaptive testing a topic for academia or is it really relevant for the industry? - How popular is adaptive testing in the industry now? Does it has any future? - What is needed to perform efficient adaptive testing and how hard is it to get it done? - What are the major challenges facing the deployment of adaptive testing? - What and how test data should be collected for adaptive testing? - When will the EDA companies start providing tools for adaptive testing? - What will be the hot research issues in adaptive testing? - Etc.
  • Keywords
    semiconductor device manufacture; semiconductor device testing; adaptive testing; process variation; silicon manufacturing process; Communities; Embedded systems; Europe; Industries; Manufacturing processes; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ETS), 2015 20th IEEE European
  • Conference_Location
    Cluj-Napoca
  • Type

    conf

  • DOI
    10.1109/ETS.2015.7138757
  • Filename
    7138757