DocumentCode
716072
Title
Evaluation of elastic properties of SiO2 thin films by ultrasonic microscopy
Author
Sakamoto, Kensuke ; Omori, Tatsuya ; Kushibiki, Jun-ichi ; Matsuda, Satoru ; Hashimoto, Ken-ya
Author_Institution
Grad. Sch. of Eng., Chiba Univ., Chiba, Japan
fYear
2015
fDate
12-16 April 2015
Firstpage
793
Lastpage
796
Abstract
This paper describes evaluation of stiffnesses of SiO2 thin films when the anisotropy in elasticity is taken into account. The authors measured the propagation direction θ dependence of the water-loaded surface acoustic waves (SAW) velocity, and tried to estimate stiffnesses of SiO2 films from the measured θ dependence. The result indicates that SiO2 films possess the strong 6mm anisotropy. Namely, stiffnesses normal to the surface are significantly lager than those along the surface. This anisotropy may be induced during the deposition or caused by variation of film properties in the thickness direction.
Keywords
acoustic microscopy; amorphous semiconductors; elasticity; mechanical variables measurement; semiconductor thin films; silicon compounds; surface acoustic waves; ultrasonic measurement; ultrasonic velocity; SiO2; anisotropy; elastic properties evaluation; elasticity; size 6 mm; thickness direction; thin film stiffness evaluation; ultrasonic microscopy; water-loaded surface acoustic waves velocity; Anisotropic magnetoresistance; Microscopy; Silicon; Substrates; Surface acoustic waves; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium & the European Frequency and Time Forum (FCS), 2015 Joint Conference of the IEEE International
Conference_Location
Denver, CO
Print_ISBN
978-1-4799-8865-5
Type
conf
DOI
10.1109/FCS.2015.7138960
Filename
7138960
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