• DocumentCode
    716072
  • Title

    Evaluation of elastic properties of SiO2 thin films by ultrasonic microscopy

  • Author

    Sakamoto, Kensuke ; Omori, Tatsuya ; Kushibiki, Jun-ichi ; Matsuda, Satoru ; Hashimoto, Ken-ya

  • Author_Institution
    Grad. Sch. of Eng., Chiba Univ., Chiba, Japan
  • fYear
    2015
  • fDate
    12-16 April 2015
  • Firstpage
    793
  • Lastpage
    796
  • Abstract
    This paper describes evaluation of stiffnesses of SiO2 thin films when the anisotropy in elasticity is taken into account. The authors measured the propagation direction θ dependence of the water-loaded surface acoustic waves (SAW) velocity, and tried to estimate stiffnesses of SiO2 films from the measured θ dependence. The result indicates that SiO2 films possess the strong 6mm anisotropy. Namely, stiffnesses normal to the surface are significantly lager than those along the surface. This anisotropy may be induced during the deposition or caused by variation of film properties in the thickness direction.
  • Keywords
    acoustic microscopy; amorphous semiconductors; elasticity; mechanical variables measurement; semiconductor thin films; silicon compounds; surface acoustic waves; ultrasonic measurement; ultrasonic velocity; SiO2; anisotropy; elastic properties evaluation; elasticity; size 6 mm; thickness direction; thin film stiffness evaluation; ultrasonic microscopy; water-loaded surface acoustic waves velocity; Anisotropic magnetoresistance; Microscopy; Silicon; Substrates; Surface acoustic waves; Velocity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium & the European Frequency and Time Forum (FCS), 2015 Joint Conference of the IEEE International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4799-8865-5
  • Type

    conf

  • DOI
    10.1109/FCS.2015.7138960
  • Filename
    7138960