DocumentCode
71859
Title
Enhancing Low Temperature Analog Performance of Underlap FinFET at Scaled Gate Lengths
Author
Nandi, A.K. ; Saxena, Alok Kumar ; Dasgupta, S.
Author_Institution
Dept. of Electron. & Comput. Eng., IIT Roorkee, Roorkee, India
Volume
61
Issue
11
fYear
2014
fDate
Nov. 2014
Firstpage
3619
Lastpage
3624
Abstract
Higher mobility and smaller subthreshold slope are some attractive features of low-temperature operation of FinFETs at scaled gate lengths. However, very little effort has been made to enhance the analog performance of the device at lower gate lengths. In this paper, we have studied the low temperature analog performance of underlap FinFET at 16-nm gate length. We have observed that for low-temperature analog operation, high-k gate dielectric is not a viable option at this gate length, as the intrinsic dc gain (AV0) decreases with increase in dielectric constant of the gate dielectric because of a pronounced increase in fringe-induced barrier lowering. On the other hand, dual-k spacer-based underlap FinFET is a promising candidate in improving critical analog figures of merit (FOM), such as intrinsic dc gain (AV0), cutoff frequency (fT), and maximum oscillation frequency (fmax) as the temperature is reduced. More so, the percentage increase in FOM of dual-k FinFET is enhanced at lower temperature as well as at lower gate length. Therefore, dual-k spacer underlap FinFET can be a possible solution for further device scaling at low-temperature environment.
Keywords
MOSFET; carrier mobility; dielectric materials; permittivity; FOM; analog figures of merit; cutoff frequency; device scaling; dielectric constant; dual-k spacer underlap FinFET; fringe-induced barrier lowering; high-k gate dielectric; intrinsic dc gain; low temperature analog performance enhancement; maximum oscillation frequency; mobility feature; scaled gate length; size 16 nm; subthreshold slope; underlap FinFET; Dielectric constant; FinFETs; Logic gates; Performance evaluation; Temperature distribution; Threshold voltage; Carrier mobility; dual-k spacer; figures of merit (FOM); low-temperature operation;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2353139
Filename
6899653
Link To Document