• DocumentCode
    7202
  • Title

    Petri Net Modeling and Cycle-Time Analysis of Dual-Arm Cluster Tools With Wafer Revisiting

  • Author

    Wu, NaiQi ; Chu, Feng ; Chu, Chengbin ; Zhou, MengChu

  • Author_Institution
    Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    43
  • Issue
    1
  • fYear
    2013
  • fDate
    Jan. 2013
  • Firstpage
    196
  • Lastpage
    207
  • Abstract
    There are wafer fabrication processes in cluster tools that require wafer revisiting. If a swap strategy is applied to dual-arm cluster tools handling wafer revisiting, a three-wafer periodical process is formed with three wafers completed in each period. Such a period contains three cycles in a revisiting process and three cycles in a nonrevisiting one. Hence, analysis and scheduling of such tools become very complicated. In this paper, a Petri net (PN) model is developed to describe their operations. Based on it, it is found that, if a swap strategy is applied, such tools are always in a transient state. A systematic method is then presented to analyze their performance. With the help of the proposed PN model, this work, for the first time, derives the optimality conditions of three-wafer period scheduling. Industrial application examples are given to show the results.
  • Keywords
    Petri nets; cluster tools; scheduling; semiconductor industry; semiconductor technology; PN model; Petri net modeling; cycle-time analysis; dual-arm cluster tool; swap strategy; systematic method; three-wafer period scheduling; three-wafer periodical process; transient state; wafer fabrication process; wafer revisiting; Color; Fabrication; Load modeling; Optimal scheduling; Robots; Schedules; Semiconductor device modeling; Cluster tool; Petri nets (PNs); discrete event system; scheduling; semiconductor manufacturing;
  • fLanguage
    English
  • Journal_Title
    Systems, Man, and Cybernetics: Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2168-2216
  • Type

    jour

  • DOI
    10.1109/TSMCA.2012.2187890
  • Filename
    6174478