Reciprocating surface grinding of semiconductor wafers: A kinematic model for grinding marks & pattern

Reciprocating surface grinding is one of state-of-the-art machining processes to flatten semiconductor wafers to obtain a better surface roughness and grinding marks uniformity. In this paper, a kinematic model is developed to study the grinding marks pattern resulted from the reciprocating surface grinding. The model is then utilized to simulate the grinding marks and compared with rotary surface grinding. Experiments are also conducted to verify the simulation results.