DocumentCode
722049
Title
Design of wide bandwidth pyramidal microwave absorbers with ferrite composites of broad magnetic loss spectrum
Author
Park, M. ; Ryu, Y. ; Liu, T. ; Kim, S.
Author_Institution
Adv. Mater. Eng., Chungbuk Nat. Univ., Cheongju, South Korea
fYear
2015
fDate
11-15 May 2015
Firstpage
1
Lastpage
1
Abstract
The wide bandwidth pyramidal microwave absorbing materials are required for use in antenna and electromagnetic compatibility (EMC) anechoic chambers. The main design criteria are to maximize the frequency range that can be utilized in the test volume available. Ferrite tile absorbers have good absorbing performance below 1 GHz with a few millimeters in thickness. For the attainment of microwave attenuation above 1 GHz, pyramidal ohmic absorbers (which are in the form of carbon-embedded urethane foam) are conventionally used. For this pyramidal absorber, however, the overall thickness is too big (in general, above 30 cm) restricts its use in small or semi-anechoic chambers.The purpose of this study is to design the pyramidal absorbers with wide bandwidth and reduced thickness by using lossy ferrite materials . Three types of ferrite materials (NiZn spinel ferrite, Co2Z hexaferrite, and RuCoM hexaferrite) with different frequency dispersion of magnetic loss were used as the absorbent fillers in polymer matrix .
Keywords
barium compounds; cobalt compounds; ferrites; filled polymers; microwave materials; microwave spectra; nickel compounds; ruthenium compounds; zinc compounds; Ba3Co2Fe24O41; BaRu0.7Co0.7Fe11.6O19; Ni0.2Zn0.8Fe2O4; absorbent fillers; antenna; broad magnetic loss spectrum; electromagnetic compatibility anechoic chambers; ferrite composites; frequency dispersion; hexaferrite; lossy ferrite materials; polymer matrix; spinel ferrite; wide bandwidth pyramidal microwave absorbers; Approximation methods; Bandwidth; Ferrites; Magnetic losses; Magnetic resonance; Microwave theory and techniques; Reflection;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4799-7321-7
Type
conf
DOI
10.1109/INTMAG.2015.7157337
Filename
7157337
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