Temperature-aware power distribution network designs for 3D ICs and systems

Many recent problems related to integrated circuits have been solved by three-dimensional integration using throughsilicon vias. This technique presents some thermal-related issues related to high thermal density. In this work, we estimate the effects of temperature on power distribution networks consisting of a printed circuit board, an interposer, and stacked dies connected by through-silicon vias. The model we built has various on- and off-chip decoupling capacitors, so this paper analyzes the effects of temperature on power delivery network impedance and power ground noise using temperature-aware simulations. The results indicate that a high temperature density system requires both temperature-aware simulation and design. Based on further simulations with practical cases, this paper also presents an efficient power delivery network design method for three-dimensional systems consisting of various types of decoupling capacitors and heterogeneous dies.