Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package

Author

Kamgaing, Telesphor ; Elsherbini, Adel A. ; Oster, Sasha N. ; Cohen, Emanuel

Author_Institution

Components Res., Intel Corp., Hillsboro, AZ, USA

fYear

2015

fDate

26-29 May 2015

Firstpage

994

Lastpage

998

Abstract

We present an ultra-thin, low cost, fully integrated 60GHz phased array antenna module supporting 18 TX/RX antenna elements for 60 GHz WiGig applications. The RFIC is assembled on a 15 mm × 12 mm liquid crystal polymer (LCP) package containing the antenna elements. All millimeter-wave signal routing was done on the same layer as the die pads to minimize the number of package substrate layers (4 total metal layers) and achieve very small total package thickness of 0.41 mm. The measurement results for the package showed good agreement with the simulation. The measured peak directivity of the steerable array was 17.4 dBi and routing losses were 0.5 - 1dB.

Keywords

antenna phased arrays; flip-chip devices; integrated circuit packaging; liquid crystal polymers; millimetre wave integrated circuits; LCP package; RFIC; RX antenna elements; TX antenna elements; WiGig application; flip chip package; frequency 60 GHz; millimeter-wave signal routing; multilayer liquid crystal polymer package; package substrate layers; phased array antenna module; size 0.41 mm; size 12 mm; size 15 mm; Arrays; Metals; Phased arrays; Routing; Substrates; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/ECTC.2015.7159716

Filename

7159716