DocumentCode
72320
Title
A Low Power Logic-Compatible Multi-Bit Memory Bit Cell Architecture With Differential Pair and Current Stop Constructs
Author
Lynch, John ; Irazoqui, P.P.
Author_Institution
Weldon Sch. of Biomed. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
61
Issue
12
fYear
2014
fDate
Dec. 2014
Firstpage
3367
Lastpage
3375
Abstract
The architecture in this work uses a logic-compatible CMOS process particularly suitable for embedded applications. The differential pair construct causes the read and refresh power to be independent of any process parameter including the within-die threshold voltage. The current stop feature keeps the read voltage transition low to further minimize read power. The bit cell operates in both single bit BASE2 and multi-bit BASE4 modes. An expression for the read signal was verified with bit cell simulations. These simulations also compare the performance impact of threshold voltage variance in this architecture with a standard gain cell. A DRAM bit cell array was fabricated in the XFab 180 nm CMOS process. Measured waveforms closely match theoretical results obtained from a system simulation. The silicon retention time was measured at room temperature and is greater than 150 ms in BASE2 mode and greater than 75 ms in BASE4 mode. 180 nm, 25C analysis predicts 0.8 uW/Mbit refresh power at 630 MHz, the lowest in the literature. Further: the memory bit cell architecture presented here has a refresh power delay product several times lower than any other published architecture.
Keywords
CMOS logic circuits; CMOS memory circuits; DRAM chips; embedded systems; logic design; low-power electronics; DRAM bit cell array; XFab CMOS process; bit cell simulations; current stop constructs; differential pair construct; embedded applications; frequency 630 MHz; logic-compatible CMOS process; low power logic-compatible multibit memory bit cell architecture; multibit BASE4 mode; process parameter; read power; read signal; read voltage transition; refresh power delay product; silicon retention time; single bit BASE2 mode; size 180 nm; standard gain cell; threshold voltage variance; within-die threshold voltage; Capacitance; Computer architecture; Mathematical model; Microprocessors; Standards; Threshold voltage; Transistors; Current stop; MLDRAM; differential pair; eDRAM; embeddable; logic-compatible; low power; multi-bit; opamp; threshold voltage;
fLanguage
English
Journal_Title
Circuits and Systems I: Regular Papers, IEEE Transactions on
Publisher
ieee
ISSN
1549-8328
Type
jour
DOI
10.1109/TCSI.2014.2334791
Filename
6899695
Link To Document